ANALYSIS AND OPTIMIZATION OF ACTIVATED CARBON COATED HEAT SINKS

With the enhancements in nanotechnology, electronic devices shrank size which led to a necessity develop efficient thermal management strategies. These small could be thermally managed through passive systems provided that effective materials are developed. Here, we use layer of activated carbon on top anodized aluminum heat sinks utilize sorption cycle atmospheric water create desorption induced evaporative cooling effect. The material properties lead enhanced by radiation and desorption, while geometry ensure surface area maximization. We numerical simulation platform determine optimum optimal coating mass. Our results show as fin diameter spacing shrink, mass increases within considered range (0-100 mg), chip achieved. further employ our simulations decouple effects radiation, convection. analyses reveal only plays vital role during initial periods operation, due convection leads an ≈20% increase overall steady-state transfer coefficient. This study goes beyond introducing strategy for chips providing link between diffusion processes transient operation devices.